The special polymer material is lightweight and offers good pressure resistance, allowing consumers to experience a light and rebounding stride with every step they take during exercise.

The newly developed PTU foam particles offer remarkable supple rebound capability and excellent compression durability. Experiments have shown a significant increase in resilience and a reduction in energy loss compared with ordinary materials, creating a comfortable exercise experience with dynamic rebound performance.

The lightweight midsole technology and TPU hollow structure of the full-foot midsole effectively reduces the weight of the outsole and dissipates heat from the foot, helping evaporate sweat from the foot, circulate air in and out of the shoe cavity, and reduce load during exercising.

Features a cushioning system comprising single or multiple air cushion structures of varying shapes. Its assortment is based on dynamic pressure distribution on the sole, resulting in effective pressure-buffer and shock absorption.

After conducting an in-depth study on the human gait and distribution of stress points, a collection of independent soft cube modules for the sole was developed, which can arrange flexibly according to the dynamic pressure distribution of the sole, providing a comfortable stepping experience.

Equipped with “XTEP ACE” cushioning technology, the marathon-graded CPU outsole is three times more wear resistant than ordinary rubber shoe soles and 60% lighter. The surface material, based on the “lotus leaf effect” principle of natural bionics, is water-resistant and easy to clean, helping protect the shoes from rain and dampness.

The unique hollow structuring design provides cushioning effectively. The double-layered hollow design of the rear sole section also enhances the space and level of force deformation to provide good shock absorption performance.

Featuring the world’s first “PISA” supercritical foam technology, the “XTEP ACE” cushioning technology provides superb rebound while remaining lightweight. Its world-class T700 carbon fiber plate provides powerful propulsion for runners. Its ultra-thin and lightweight CPU outsole offers excellent wear resistance to help runners make breakthroughs in their top speed.

The XTEP ACE cushioning technology showcases the innovative "PISA" supercritical foam technology, incorporating a full-foot sole nylon fiber board tailored to the foot shape and a marathon-graded CPU outsole to effectively minimize dorsiflexion in metatarsophalangeal joints and enhance muscular strength.